Multiface
CTTC is involved in various collaborative projects, and Multiface is one of them.
Additive manufacturing of ceramic electronic components
Electronics / Antennas and Sensors / Additive Manufacturing
Through the MULTIFACE project (Additive Manufacturing of MULTI-material Ceramic Components by 3D Printing), the company EGIDE, the XLIM laboratory, and CTTC aimed to develop new additive manufacturing solutions for electronic components.
In terms of applications, it specifically targeted high-frequency packaging solutions (80/100 GHz), high-density routing Multi-Chip modules, System-In-Package integrating passive functions (such as filters, capacitors, or inductors), and three-dimensional structured housings with complex connectivity or metallization, made from HTCC ceramic.
The use of additive manufacturing technologies indeed allows pushing the limits of metallic line fineness by a factor of 5 and ultimately eliminates the need for sheet-by-sheet handling of multilayer ceramics, representing a technological breakthrough for many application fields.
MULTIFACE received funding from the Direction Générale de l’Armement \ Agence de l’Innovation de Défense (AID) through the RAPID program.
Project carried out from 2017 to 2020
Budget: €800,000
Collaboration: CTTC, EGIDE, XLIM
Results
The project enabled the development of essential expertise for the formulation of ceramic and metallic inks intended for HTCC (High-Temperature Co-fired Ceramics) applications.
Moreover, the possibility of ceramic-metal stacking was demonstrated, notably with the crossing of conductive lines insulated from each other by a ceramic strip. The project led to the fabrication of passive structures and the commercialization of a ceramic ink for inkjet printing as well as a metallic ink for aerosol jet printing.
